JPH053740B2 - - Google Patents

Info

Publication number
JPH053740B2
JPH053740B2 JP10980786A JP10980786A JPH053740B2 JP H053740 B2 JPH053740 B2 JP H053740B2 JP 10980786 A JP10980786 A JP 10980786A JP 10980786 A JP10980786 A JP 10980786A JP H053740 B2 JPH053740 B2 JP H053740B2
Authority
JP
Japan
Prior art keywords
lead
power supply
aging
lead frame
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP10980786A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62265731A (ja
Inventor
Minoru Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP10980786A priority Critical patent/JPS62265731A/ja
Publication of JPS62265731A publication Critical patent/JPS62265731A/ja
Publication of JPH053740B2 publication Critical patent/JPH053740B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP10980786A 1986-05-13 1986-05-13 リ−ドフレ−ム Granted JPS62265731A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10980786A JPS62265731A (ja) 1986-05-13 1986-05-13 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10980786A JPS62265731A (ja) 1986-05-13 1986-05-13 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS62265731A JPS62265731A (ja) 1987-11-18
JPH053740B2 true JPH053740B2 (en]) 1993-01-18

Family

ID=14519702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10980786A Granted JPS62265731A (ja) 1986-05-13 1986-05-13 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS62265731A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02135793A (ja) * 1988-11-16 1990-05-24 Ibiden Co Ltd 厚膜素子を有するフィルムキャリアの製造方法
US5239191A (en) * 1990-01-19 1993-08-24 Kabushiki Kaisha Toshiba Semiconductor wafer

Also Published As

Publication number Publication date
JPS62265731A (ja) 1987-11-18

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